EMRFD Message Archive 7162
Message Date From Subject 7162 2012-01-09 09:17:06 VU3AUZ BGA Inspection - Requesting Suggestions & Guidance
I know that this is slightly off-topic. But if someone could help...
I am stuck with the BGA solder inspection of an IC having the following physical specification in terms of Soldering.
Size: 2.5sq.cm
Lead type: BGA
Ball Pitch: 0.65mm
Pin Count: 1031
The assembly was done using Lead Free Technology.
X-ray inspection failed miserably, since the IC has a metal cap meant for Thermal Dissipation.
If anyone has industrial level experience in BGA's, their guidance will be helpful.
Thanks in Advance,
VU3AUZ, Allen Antony
Chennai/Blore
+91-94473 197277163 2012-01-09 10:37:05 Graham / KE9H Re: BGA Inspection - Requesting Suggestions & Guidance
You must be using the wrong kind of X-Ray machine.
The machines used for industrial quality control and inspection
on BGA's routinely can look through the heat spreaders on the
parts, and the very latest technology provide a 3-D image, so must use
some kind of tomography
techniques.
--- Graham / KE9H
==
7164 2012-01-09 11:05:06 Paul Anderson Re: BGA Inspection - Requesting Suggestions & Guidance
Sent from my iPhone
On 2012-01-09, at 12:17 PM, "VU3AUZ" <allen_marian2005@yahoo.com> wrote:
> Hello all,
>
> I know that this is slightly off-topic. But if someone could help...
>
> I am stuck with the BGA solder inspection of an IC having the following physical specification in terms of Soldering.
> Size: 2.5sq.cm
> Lead type: BGA
> Ball Pitch: 0.65mm
> Pin Count: 1031
> The assembly was done using Lead Free Technology.
> X-ray inspection failed miserably, since the IC has a metal cap meant for Thermal Dissipation.
>
> If anyone has industrial level experience in BGA's, their guidance will be helpful.
>
> Thanks in Advance,
> VU3AUZ, Allen Antony
> Chennai/Blore
> +91-94473 19727
>
>
>
> ------------------------------------
>
> Yahoo! Groups Links
>
>
>7165 2012-01-09 11:09:43 Leon Heller Re: BGA Inspection - Requesting Suggestions & Guidance
> Hello all,There are optical devices using a tiny prism that allow the balls to be
>
> I know that this is slightly off-topic. But if someone could help...
>
> I am stuck with the BGA solder inspection of an IC having the following
> physical specification in terms of Soldering.
> Size: 2.5sq.cm
> Lead type: BGA
> Ball Pitch: 0.65mm
> Pin Count: 1031
> The assembly was done using Lead Free Technology.
> X-ray inspection failed miserably, since the IC has a metal cap meant
> for Thermal Dissipation.
>
> If anyone has industrial level experience in BGA's, their guidance will
> be helpful.
inspected visually.
Leon
--
Leon Heller
G1HSM